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With the mission of “Smart Manufacturing - Global Delivery”, we help our customers shorten the time-to-market and optimize the supply chain cost through continuous technology iteration and digital upgrading. We look forward to working with you to define the future of electronic manufacturing!

 

  • Technology Driven Intelligent Manufacturing
  • Full-process quality control
  • In-depth industry experience
  • Agile Service Network
EdgePCBA

Ceramic PCB

EdgePCBA manufactures ceramic printed circuit boards (PCBs).Ceramic PCBs are advanced printed circuit boards made using ceramic substrates such as Aluminum Oxide (Al₂O₃), Aluminum Nitride (AlN), or Beryllium Oxide (BeO). These boards offer excellent thermal conductivity, electrical insulation, and mechanical stability, making them ideal for high-power, high-frequency, and high-reliability applications.

Unlike traditional FR4-based boards, ceramic PCBs can withstand extreme environments and maintain performance in high-temperature or high-voltage scenarios.

Flexible PCB

Flexible PCB

HDI PCB

HDI PCB

High Frequency PCB

High Frequency PCB

High Speed PCB

High Speed PCB

Rigid-flex PCB

Rigid-flex PCB

Metal PCB

Metal PCB

Ceramic PCB

Ceramic PCB

Ceramic PCB Manufacturing Services

High-performance printed circuit boards made with ceramic-based substrates such as aluminum oxide (Al₂O₃), aluminum nitride (AlN), or beryllium oxide (BeO). These materials offer superior thermal conductivity, electrical insulation, and mechanical stability, making them ideal for high-power, high-frequency, and high-reliability applications.

  • Advanced Materials: We offer a wide range of ceramic substrates tailored to your needs: Aluminum Oxide (Al₂O₃) – Cost-effective, widely used; Aluminum Nitride (AlN) – High thermal conductivity, low thermal expansion; Beryllium Oxide (BeO) – Exceptional thermal performance (limited use due to toxicity concerns)
  • Excellent Thermal Management: Ceramic PCBs provide superior heat dissipation without the need for additional heat sinks or cooling systems, ensuring stable performance in high-power applications.
  • High Electrical Insulation: Ceramic substrates offer excellent dielectric strength and insulation resistance, even under extreme thermal and electrical stress.
  • Compact, Reliable Design: These PCBs support miniaturization, reduce interconnect complexity, and enhance mechanical strength—ideal for demanding applications in aerospace, medical, and power electronics.
  • Manufacturing Capabilities: Substrate thickness: 0.25mm – 3mm; Metallization: Copper (DPC, DBC), Silver, Gold; Single-layer, multilayer, and hybrid structures; Surface finishes: ENIG, OSP, Silver plating, etc.; Precision laser drilling and CNC routing

Why Choose Ceramic PCBs?

High thermal conductivity, excellent electrical insulation, and reliable performance in harsh environments. They outperform traditional FR4 and even metal-core PCBs in many high-end and high-power scenarios.

  • Superior Thermal Conductivity: Ceramic materials like Aluminum Nitride (AlN) and Beryllium Oxide (BeO) offer exceptional heat dissipation (up to 200+ W/m·K), eliminating the need for bulky heat sinks and reducing thermal stress on components.
  • Outstanding Electrical Insulation: Ceramic substrates combine high thermal performance with excellent dielectric strength, maintaining insulation even at elevated voltages and temperatures.
  • High Reliability in Harsh Environments: Ceramic PCBs are highly resistant to moisture, corrosion, vibration, and extreme temperatures, making them perfect for aerospace, automotive, medical, and industrial electronics.
  • Support for High-Power & High-Frequency Applications: Ceramic PCBs are ideal for RF/microwave circuits and power modules, providing low signal loss, stable performance, and reduced parasitic effects at high frequencies.
  • Compact, High-Density Integration: Due to their high thermal and electrical performance, ceramic PCBs allow for smaller designs with higher power densities, supporting miniaturization without sacrificing reliability.
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ASSEMBLY CAPABILITIES

Assembly Capabilities for PCBs

Stencil Size Range

29inch*29inch

SMT

Position accuracy: 25um
Components size:0201--150mm
Max.PCB Size:680mm*500mm
MinPCB size:50mm*50mm
Min.PCB Thickness:0.3mm-- 6mm
Min.IC Pitch: 0.30mm

Wave-Solder

Max.PCB width:450mm Min.PCB width:no Limited Component height: Top 120mm/Bottom 15mm

Min.BGA pitch

0.008"

Max.BGA Size

74mm x74mm

BGA Ball Pitch

1.00mm(Min);3.00mm(Max)

BGA Ball Diameter

0.40mm(Min);1.00mm(Max)

QFP Lead Pitch

0.38mm(Min);2.54mm(Max)

For further discussion about PCB Assembly, please contact us.

MATERIALS

Diversified PCB Assembly Materials You Can Choose

  • FR-4
  • Glass epoxy
  • FR4 High Tg
  • Rohs compliant
  • Aluminum
  • Rogers
  • FR-4
  • Glass epoxy
  • FR4 High Tg
  • Rohs compliant
  • Aluminum
  • Rogers
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our pcbs

LAYERS

Customizable PCB Boards Up to 32 Layers

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our pcbs

Assemble Your PCB Now!

Don't hesitate to reach out if you require any help or have specific customization requirements that we can cater to.

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