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With the mission of “Smart Manufacturing - Global Delivery”, we help our customers shorten the time-to-market and optimize the supply chain cost through continuous technology iteration and digital upgrading. We look forward to working with you to define the future of electronic manufacturing!

 

  • Technology Driven Intelligent Manufacturing
  • Full-process quality control
  • In-depth industry experience
  • Agile Service Network
EdgePCBA

HDI PCB

In the ever-evolving world of electronics, innovation is the driving force behind smaller, faster, and more powerful devices. HDI PCBs (High-Density Interconnect Printed Circuit Boards) are advanced circuit boards characterized by higher wiring density per unit area compared to conventional PCBs. They incorporate features such as microvias, blind and buried vias, and fine lines and spaces to achieve compact, high-performance designs. HDI technology is essential for modern electronics that require increased functionality in smaller form factors.

HDI PCBs Manufacturing Services

EdgePCBA delivers cutting-edge solutions for high-performance, miniaturized electronic products. Designed for complex circuitry and advanced applications, HDI PCBs feature fine lines, microvias, blind/buried vias, and high layer counts — all manufactured with precision and reliability.

 

Core Capabilities

  • Advanced Layer Constructions: 1+N+1, 2+N+2, ELIC (Every Layer Interconnect) structures to support dense, multi-functional designs.
  • Microvia Drilling: Laser via drilling for tight spaces and high-speed signal transmission.
  • Fine Line/Space Fabrication: Trace widths as low as 50μm (2 mil) with excellent impedance control.
  • High Aspect Ratio Plating: Ensures stable connectivity and signal integrity for stacked and staggered vias.
  • High-Speed Material Options: Low-loss materials like Rogers, Megtron, and Isola for RF and high-frequency applications.

Why Choose HDI PCBs?

Key Reasons to Choose HDI PCBs

  • Miniaturization Without Compromise: HDI technology enables more functions in less space, making it ideal for slim and compact devices such as smartphones, tablets, and wearable tech.
  • Improved Electrical Performance: Shorter signal paths and controlled impedance reduce signal loss, crosstalk, and EMI — essential for high-speed digital and RF circuits.
  • Enhanced Design Flexibility: HDI PCBs support blind/buried vias, via-in-pad, and stacked microvias, enabling complex multilayer routing for dense circuit designs.
  • Higher Component Density: Smaller via sizes and finer traces allow for increased component placement, especially important for high-pin-count ICs like BGA, CSP, and QFN packages.
  • Increased Reliability: With fewer through-holes and improved thermal management, HDI boards offer greater mechanical strength and longer product lifespan — especially in demanding environments.
  • Lighter and Thinner: Ideal for portable electronics and applications where weight and thickness are critical factors.
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ASSEMBLY CAPABILITIES

Assembly Capabilities for PCBs

Stencil Size Range

29inch*29inch

SMT

Position accuracy: 25um
Components size:0201--150mm
Max.PCB Size:680mm*500mm
MinPCB size:50mm*50mm
Min.PCB Thickness:0.3mm-- 6mm
Min.IC Pitch: 0.30mm

Wave-Solder

Max.PCB width:450mm Min.PCB width:no Limited Component height: Top 120mm/Bottom 15mm

Min.BGA pitch

0.008"

Max.BGA Size

74mm x74mm

BGA Ball Pitch

1.00mm(Min);3.00mm(Max)

BGA Ball Diameter

0.40mm(Min);1.00mm(Max)

QFP Lead Pitch

0.38mm(Min);2.54mm(Max)

For further discussion about PCB Assembly, please contact us.

MATERIALS

Diversified PCB Assembly Materials You Can Choose

  • FR-4
  • Glass epoxy
  • FR4 High Tg
  • Rohs compliant
  • Aluminum
  • Rogers
  • FR-4
  • Glass epoxy
  • FR4 High Tg
  • Rohs compliant
  • Aluminum
  • Rogers
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our pcbs

LAYERS

Customizable PCB Boards Up to 32 Layers

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our pcbs

Assemble Your PCB Now!

Don't hesitate to reach out if you require any help or have specific customization requirements that we can cater to.

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